Description
CE12808E overview
The CE12804E/CE12808E/CE12816E system uses an orthogonal connector architecture without a backplane. This architecture, together with the dynamic distributed large buffer on line cards, can better handle high traffic rates and traffic bursts resulting from cloud computing.
The CE12800E series switches are highly scalable. A chassis provides 6.48 Tbit/s per slot bandwidth and a maximum of 77.76 Tbit/s switching capacity. The CE12800E series switches support the cluster switch system (CSS) technology, which virtualizes multiple physical devices into one logical device to simplify network management and improve network reliability.
CE12808E appearance

1. CE12800E series switches chassis header, showing the following:
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2. Front ESD jack
NOTE: When maintaining components at the front of a chassis, wear an ESD wrist strap and insert the other end of the ESD wrist strap into this ESD jack. |
3. Air intake area for SFUs in the CE12808E chassis (See Airflow for heat dissipation of the SFUs (side view) for the heat dissipation mechanism.) |
| 4. LPUs
The CE12808E chassis supports eight LPUs. |
5. Two MPUs
The MPU model used in the CE12808E chassis is CE-MPUA-E. |
6. Power modules
The CE12808E chassis supports eight 3000 W AC power modules or eight 2200 W DC power modules. |
| 7. Cable management frame
NOTE: Cable management frames are installed on the left and right sides of a chassis to route cables in each slot. |
8. Fan modules
The CE12808E chassis supports three FAN-180B-B Fan Module and two FAN-720A-B Fan Module. |
9. SFU
The CE12808E chassis supports six CE-SFU08C-E or CE-SFU08G-X cards. |
| 10. Rear ESD jack
NOTE: When maintaining components at the rear of a chassis, wear an ESD wrist strap and insert the other end of the ESD wrist strap into this ESD jack. |
11. Two ground points for a dual-hole ground lug, with a yellow grounding label attached
NOTE: To protect a chassis from lightning and electromagnetic interference, use Ground Cable to ground the chassis. |
12. Serial number label |
| 13. MAC address label | 14. Air exhaust area for power modules in the CE12808E chassis (See Airflow for heat dissipation of the power modules (side view) for the heat dissipation mechanism.) | – |
















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