Single-Phase Immersion Liquid Cooling Compute Module Standards – Official Technical Overview & Hardware Datasheet

EXECUTIVE SUMMARY

The Single-Phase Immersion Liquid Cooling Compute Module Standards define a carrier-grade, high-density compute architecture engineered for direct single-phase immersion cooling environments. This standard establishes mechanical, thermal, electrical, and management interfaces for compute modules deployed in next-generation edge and core data centers. By replacing air-based thermal management with dielectric liquid immersion, the standard enables a 4x increase in rack power density, a 40% reduction in cooling energy overhead, and a 99.999% availability target for telecom and enterprise workloads.

The standard is vendor-agnostic in its interface definitions while remaining fully compliant with NEBS Level 3, ETSI, and IEC 60950-1 safety frameworks. It supports both 48V DC and 400V HVDC power distribution, making it suitable for telco central offices, edge micro-data centers, and hyperscale immersion-ready facilities.

ARCHITECTURE & CHASSIS DESIGN

The immersion compute module standard specifies a sealed, liquid-compatible chassis with a standardized 1RU/2RU horizontal form factor and a blind-mate fluid manifold interface. The chassis is constructed from nickel-plated copper and stainless steel 316L to resist long-term dielectric fluid exposure. Internal components are coated with a parylene-C conformal layer to prevent electrochemical migration and tin whisker formation.

Key mechanical features include:
– Standardized immersion-safe connectors with IP68 sealing
– Integrated drip trays and fluid containment channels
– Tool-less module extraction with self-sealing quick-disconnects
– Front-to-back fluid flow path with Parameter Specification

Form Factor 1RU / 2RU immersion-safe chassis Compute Architecture Dual-socket x86 or ARM SoC Memory Up to 16x DDR5 RDIMM, 4800 MT/s Network Interfaces 2x 100GbE KR4, 4x 25GbE SFP28, 2x 400GbE QSFP-DD Management 1GbE BMC, Redfish 1.8, IPMI 2.0 Power Input 48V DC nominal, 400V HVDC optional Power Consumption 800W to 2400W per module Cooling Fluid Single-phase dielectric, flash point >160°C Operating Temperature 15°C to 45°C fluid inlet Dimensions (HxWxD) 44mm x 430mm x 800mm (1RU) Weight 12 kg to 22 kg depending on configuration MTBF >500,000 hours at 40°C fluid inlet Compliance NEBS Level 3, ETSI, IEC 62368-1, RoHS Serviceability Hot-swap module, blind-mate fluid manifold Security TPM 2.0, Secure Boot, optional line-rate encryption

ORDERING OPTIONS

The standard supports multiple SKU tiers to address varied compute and network requirements:
– ICM-1000 Series: 2RU, dual-socket, 32 DIMM, 2x100GbE
– ICM-2000 Series: 1RU, single-socket, 16 DIMM, 4x25GbE
– ICM-3000 Series: 2RU, dual-socket, 16 DIMM, 2x400GbE
– ICM-4000 Series: 1RU, single-socket, 8 DIMM, 2x100GbE, NEBS Level 3

Each series includes immersion-compatible power cables, fluid-compatible gaskets, and a factory-applied conformal coating certificate.