TNG3CXP

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SKU2017087
AvailabilityIn Stock
WarrantyUp to 36 months i
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Huawei OptiX OSN 9800 TNG3CXP Universal Cross Connect, System Control and Clock Processing Board

Description

TNG3CXP overview

 

TNG3CXP System auxiliary Communication Board With Clock Processing Function applied  to Huawei OptiX OSN 9800 M24.

To meet ultra-large cross-connect capacity and bandwidth requirements, Huawei presents the OptiX OSN 9800 product series. The OptiX OSN 9800 product series include the OptiX OSN 9800 U64, U32, P18 and universal platform subracks. Applied at the electrical layer, the OptiX OSN 9800 U64 and U32 subracks share boards by using unified software and hardware platforms, and can work with the OptiX OSN 9800 universal platform subrack and P18 subrack, OptiX OSN 8800 platform subrack and T16 subrack, and OptiX OSN 6800 optical subracks in WDM and OTN systems.

The TNG3CXP board variant is TNG3CXP01.

 

Front panel of the TNG3CXP board

TNG3CXP

Front panel of the TNG3CXP board

 

Valid slots for the TNG3CXP board in a  M24 subrack

Device Number of Occupied Slots Physical Slot Logical Slot
OptiX OSN 9800 M24 1 IU71, IU72 IU71, IU72
Item TNG3CXP
Basic function
  • Cross-connects ODUk (k = 0, 1, 2, 2e, 3, 4, or flex) signals, VC-4 signals, packet signals and OSUflex inside a subrack, configures management, and outputs alarms.
  • Supports the backup of the NE data. When the NE data changes, the real-time database backup function immediately saves the changed configuration data into the storage medium to ensure that no configuration data is lost after the NE is reset (cold) or powered off. This improves the reliability of the NE.
OTN cluster Not Supported
Electrical-layer ASON Supported
Master-Slave subrack Supports subrack cascading.
DCC Supports interconnection and communication between NEs through IP over DCC, or HWECC.
Backup mode Supports 1+1 hot backup. When the active board is faulty, services are automatically switched to the standby board.

Functions and Features of the TNG3CXP Board (Cross-Connect Unit)

Basic function The board grooms and protects ODUk (k = 0, 1, 2, 2e, 3, 4, or flex), Packet, VC-4 and OSUflex signals within a subrack.
Cross-connect capacity Two small slots can be combined into one large slot. A small slot is 5.5-U high, and a large one is 11-U high.
  • 1:1 mode:
    • The ODUk (k = 0, 1, 2, 2e, 3, 4, or flex) cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4.8 Tbit/s.
    • The VC-4 cross-connect capacity of a large-slot board is 160 Gbit/s. The cross-connect capacity of the subrack is 1.92 Tbit/s.
    • The packet cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4.8 Tbit/s.
    • The OSUflex cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4.8 Tbit/s.
  • 1:3 mode:
    • The ODUk (k = 0, 1, 2, 2e, 3, 4, or flex) cross-connect capacity of a large-slot board is 1 Tbit/s. The cross-connect capacity of the subrack is 10 Tbit/s.
    • The VC-4 cross-connect capacity of a large-slot board is 160 Gbit/s. The cross-connect capacity of the subrack is 1.6 Tbit/s.
    • The packet cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4 Tbit/s.
    • The OSUflex cross-connect capacity of a large-slot board is 1 Tbit/s. The cross-connect capacity of the subrack is 10 Tbit/s.
OTN cluster Not Supported
Electrical-layer ASON Supported
SDH ASON Supported
Backup mode
  • 1:1mode: Two CXP boards form a cross-connect resource pool for service grooming. The normal running of the system is not affected when one CXP board is faulty.
  • 1:3mode: Two CXCS boards and two CXP boards form a cross-connect resource pool to implement service grooming. If more than one cross-connect board become faulty, the system will fail.

Functions and Features of the TNG3CXP Board (Clock Unit)

Basic function
  • Provides clock source for the system communications.
  • The board provides system clock signals and frame header signals for each service board.
Physical clock Supported
IEEE 1588v2 Supported
ITU-T G.8275.1 Supported
ITU-T G.8273.2 Supported
High-precision clock synchronization Supported
NOTE:
  • The high-precision clock synchronization function can be implemented only after the corresponding license is obtained.
  • The board must work with the subrack that supports high-precision clocks to support the high-precision clock synchronization function.For details, see Clock Synchronization Feature Guide.
Backup mode Supports 1+1 hot backup.
Dimensions (H x W x D)
  • 489.50 × 30.50 × 220.00 (mm)
  • 19.29 × 1.20 × 8.67 (in.)
Weight
  • 3.50 kg
  • 7.72 lb.
 

Additional information

Item TNG3CXP
Basic function
  • Cross-connects ODUk (k = 0, 1, 2, 2e, 3, 4, or flex) signals, VC-4 signals, packet signals and OSUflex inside a subrack, configures management, and outputs alarms.
  • Supports the backup of the NE data. When the NE data changes, the real-time database backup function immediately saves the changed configuration data into the storage medium to ensure that no configuration data is lost after the NE is reset (cold) or powered off. This improves the reliability of the NE.
OTN cluster Not Supported
Electrical-layer ASON Supported
Master-Slave subrack Supports subrack cascading.
DCC Supports interconnection and communication between NEs through IP over DCC, or HWECC.
Backup mode Supports 1+1 hot backup. When the active board is faulty, services are automatically switched to the standby board.

Functions and Features of the TNG3CXP Board (Cross-Connect Unit)

Basic function The board grooms and protects ODUk (k = 0, 1, 2, 2e, 3, 4, or flex), Packet, VC-4 and OSUflex signals within a subrack.
Cross-connect capacity Two small slots can be combined into one large slot. A small slot is 5.5-U high, and a large one is 11-U high.
  • 1:1 mode:
    • The ODUk (k = 0, 1, 2, 2e, 3, 4, or flex) cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4.8 Tbit/s.
    • The VC-4 cross-connect capacity of a large-slot board is 160 Gbit/s. The cross-connect capacity of the subrack is 1.92 Tbit/s.
    • The packet cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4.8 Tbit/s.
    • The OSUflex cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4.8 Tbit/s.
  • 1:3 mode:
    • The ODUk (k = 0, 1, 2, 2e, 3, 4, or flex) cross-connect capacity of a large-slot board is 1 Tbit/s. The cross-connect capacity of the subrack is 10 Tbit/s.
    • The VC-4 cross-connect capacity of a large-slot board is 160 Gbit/s. The cross-connect capacity of the subrack is 1.6 Tbit/s.
    • The packet cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4 Tbit/s.
    • The OSUflex cross-connect capacity of a large-slot board is 1 Tbit/s. The cross-connect capacity of the subrack is 10 Tbit/s.
OTN cluster Not Supported
Electrical-layer ASON Supported
SDH ASON Supported
Backup mode
  • 1:1mode: Two CXP boards form a cross-connect resource pool for service grooming. The normal running of the system is not affected when one CXP board is faulty.
  • 1:3mode: Two CXCS boards and two CXP boards form a cross-connect resource pool to implement service grooming. If more than one cross-connect board become faulty, the system will fail.

Functions and Features of the TNG3CXP Board (Clock Unit)

Basic function
  • Provides clock source for the system communications.
  • The board provides system clock signals and frame header signals for each service board.
Physical clock Supported
IEEE 1588v2 Supported
ITU-T G.8275.1 Supported
ITU-T G.8273.2 Supported
High-precision clock synchronization Supported
NOTE:
  • The high-precision clock synchronization function can be implemented only after the corresponding license is obtained.
  • The board must work with the subrack that supports high-precision clocks to support the high-precision clock synchronization function.For details, see Clock Synchronization Feature Guide.
Backup mode Supports 1+1 hot backup.
Dimensions (H x W x D)
  • 489.50 × 30.50 × 220.00 (mm)
  • 19.29 × 1.20 × 8.67 (in.)
Weight
  • 3.50 kg
  • 7.72 lb.
 

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