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TNG3CXCS
TNG3CXCS-1
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TNG3CXCS

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SKU2017027
AvailabilityIn Stock
WarrantyUp to 36 months i
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Huawei OptiX OSN 9800 TNG3CXCS Higher-order cross-connect board

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Description

TNG3CXCS overview

 

TNG3CXCS Higher-order cross-connect board applied  to Huawei OptiX OSN 9800 M24.

To meet ultra-large cross-connect capacity and bandwidth requirements, Huawei presents the OptiX OSN 9800 product series. The OptiX OSN 9800 product series include the OptiX OSN 9800 U64, U32, P18 and universal platform subracks. Applied at the electrical layer, the OptiX OSN 9800 U64 and U32 subracks share boards by using unified software and hardware platforms, and can work with the OptiX OSN 9800 universal platform subrack and P18 subrack, OptiX OSN 8800 platform subrack and T16 subrack, and OptiX OSN 6800 optical subracks in WDM and OTN systems.

The TMF1AUX board have two variants are  TNG3CXCS、TNG3CXCS02.

 

Front panel of the TNG3CXCS board

TNG3CXCS

Front panel of the TNG3CXCS board

 

Valid slots for the TNG3CXCS board in a  M24 subrack

Device Number of Occupied Slots Physical Slot Logical Slot
OptiX OSN 9800 M24 2 (IU6, IU18) IU6
(IU7, IU19) IU7
Item TNG3CXCS
Basic function Performs centralized grooming of ODUk (k = 0, 1, 2, 2e, 3, 4, or flex)/VC-4/Packet/OSUflex signals in the subrack.
Cross-connect Capacity Two small slots can be combined into one large slot. A small slot is 5.5-U high, and a large one is 11-U high.
  • The ODUk (k = 0, 1, 2, 2e, 3, 4, or flex) cross-connect capacity of a large-slot board is 1 Tbit/s. The cross-connect capacity of the subrack is 10 Tbit/s.
  • The VC-4 cross-connect capacity of a large-slot board is 160 Gbit/s. The cross-connect capacity of the subrack is 1.6 Tbit/s.
  • The packet cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4 Tbit/s.
  • The OSUflex cross-connect capacity of a large-slot board is 1 Tbit/s. The cross-connect capacity of the subrack is 10 Tbit/s.
OTN cluster Not Supported
Electrical-layer ASON Supported
SDH ASON Supported
Backup mode Two CXCS boards and two CXP boards form a cross-connect resource pool to implement service grooming. If more than one cross-connect board become faulty, the system will fail.
Dimensions (H x W x D)
  • 477.30 × 30.50 × 220.00 (mm)
  • 18.81 × 1.20 × 8.67 (in.)
Weight
  • 4.05 kg
  • 8.93 lb.

Additional information

Item TNG3CXCS
Basic function Performs centralized grooming of ODUk (k = 0, 1, 2, 2e, 3, 4, or flex)/VC-4/Packet/OSUflex signals in the subrack.
Cross-connect Capacity Two small slots can be combined into one large slot. A small slot is 5.5-U high, and a large one is 11-U high.
  • The ODUk (k = 0, 1, 2, 2e, 3, 4, or flex) cross-connect capacity of a large-slot board is 1 Tbit/s. The cross-connect capacity of the subrack is 10 Tbit/s.
  • The VC-4 cross-connect capacity of a large-slot board is 160 Gbit/s. The cross-connect capacity of the subrack is 1.6 Tbit/s.
  • The packet cross-connect capacity of a large-slot board is 400 Gbit/s. The cross-connect capacity of the subrack is 4 Tbit/s.
  • The OSUflex cross-connect capacity of a large-slot board is 1 Tbit/s. The cross-connect capacity of the subrack is 10 Tbit/s.
OTN cluster Not Supported
Electrical-layer ASON Supported
SDH ASON Supported
Backup mode Two CXCS boards and two CXP boards form a cross-connect resource pool to implement service grooming. If more than one cross-connect board become faulty, the system will fail.
Dimensions (H x W x D)
  • 477.30 × 30.50 × 220.00 (mm)
  • 18.81 × 1.20 × 8.67 (in.)
Weight
  • 4.05 kg
  • 8.93 lb.

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